Xilence Technology Xilence Silver Tim HP Termisk Kølepasta (2,5g)

K Xilence XPTP.X5 High Performance Wrmeleitpaste, Spatel, 3g Xilence ZUB-XPTP.X5 heat sink compound Xilence ZUB-XPTP.X5, 5.15 W/m·K, Black, Red, White, 73 CPS, 0.201 °C/W, -30 - 280 °C, CE Xilence ZUB-XPTP.X5. Thermal conductivity: 5.15 W/m·K, Product colour: Black, Red, White, Viscosity note: 73 CPS. Weight: 3 g. Quantity per pack: 1 pc(s), Package width: 120 mm, Package depth: 20 mm Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g. Features Thermal conductivity: 5.15 W/m·K Product colour: Black, Red, White Viscosity note: 73 CPS Thermal resistance: 0.201 °C/W Operating temperature (T-T): -30 - 280 °C Certification: CE Technical details Compliance certificates: RoHS Weight & dimensions Weight: 3 g Packaging data Quantity per pack: 1 pc(s) Package width: 120 mm Package depth: 20 mm Package height: 10 mm...